| PART |
Description |
Maker |
| EPICP451616 EPICP160808 EPICP201209 EPICP321611 EP |
Multilayer High Current Chip Beads
|
PCA ELECTRONICS INC.
|
| MLB160808 MLB160808-0060AL MLB160808-0060AM MLB160 |
MULTILAYER TYPE HIGH CURRENT FERRITE CHIP BEAD
|
http://
List of Unclassifed Manufacturers
ETC
|
| 1206J6300180KCT 1206J6300180KCR 1206J6300101KCR 12 |
CAPACITOR, CERAMIC, MULTILAYER, 630 V, C0G, 0.000018 uF, SURFACE MOUNT, 1206 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 630 V, C0G, 0.0001 uF, SURFACE MOUNT, 1206 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 630 V, C0G, 0.0000015 uF, SURFACE MOUNT, 1206 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 630 V, C0G, 0.000001 uF, SURFACE MOUNT, 1206 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 630 V, C0G, 0.000022 uF, SURFACE MOUNT, 1206 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 630 V, C0G, 0.00015 uF, SURFACE MOUNT, 1206 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 630 V, C0G, 0.00001 uF, SURFACE MOUNT, 1206 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 630 V, C0G, 0.001 uF, SURFACE MOUNT, 1206 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 630 V, C0G, 0.00012 uF, SURFACE MOUNT, 1206 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 630 V, C0G, 0.0000012 uF, SURFACE MOUNT, 1206 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 630 V, C0G, 0.00018 uF, SURFACE MOUNT, 1206 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 630 V, C0G, 0.000012 uF, SURFACE MOUNT, 1206 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 630 V, C0G, 0.0000018 uF, SURFACE MOUNT, 1206 CHIP
|
Syfer Technology, Ltd.
|
| C281P1.5UF20200V C282P1.5UF10200V C285P1.2UF10500V |
CAPACITOR, CERAMIC, MULTILAYER, 200 V, 1.5 uF, SURFACE MOUNT, 2825 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 200 V, 1.5 uF, SURFACE MOUNT, 3333 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 500 V, 1.2 uF, SURFACE MOUNT, 6560 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 200 V, 1.2 uF, SURFACE MOUNT, 4040 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 200 V, 1.8 uF, SURFACE MOUNT, 2825 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 500 V, 1.8 uF, SURFACE MOUNT, 5440 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 200 V, 1.5 uF, SURFACE MOUNT, 4040 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 200 V, 1.2 uF, SURFACE MOUNT, 2825 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 500 V, 1.2 uF, SURFACE MOUNT, 5440 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 200 V, 1.8 uF, SURFACE MOUNT, 4040 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 500 V, 1.5 uF, SURFACE MOUNT, 5440 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 200 V, 3.3 uF, SURFACE MOUNT, 16080 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 500 V, 3.9 uF, SURFACE MOUNT, 16080 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 500 V, 3.9 uF, SURFACE MOUNT, 11283 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 200 V, 3.3 uF, SURFACE MOUNT, 4040 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 200 V, 3.3 uF, SURFACE MOUNT, 6560 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 500 V, 3.9 uF, SURFACE MOUNT, 6560 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 500 V, 3.3 uF, SURFACE MOUNT, 6560 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 500 V, 3.3 uF, SURFACE MOUNT, 11283 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 500 V, 3.3 uF, SURFACE MOUNT, 16080 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 1000 V, 2.7 uF, SURFACE MOUNT, 11283 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 200 V, 2.7 uF, SURFACE MOUNT, 11283 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 500 V, 2.7 uF, SURFACE MOUNT, 11283 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 500 V, 8.2 uF, SURFACE MOUNT, 11283 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 1000 V, 0.1 uF, SURFACE MOUNT, 16080 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 10000 V, 0.01 uF, SURFACE MOUNT, 16080 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 3000 V, 0.1 uF, SURFACE MOUNT, 16080 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 2000 V, 0.1 uF, SURFACE MOUNT, 16080 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 200 V, 3.9 uF, SURFACE MOUNT, 16080 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 5000 V, 0.1 uF, SURFACE MOUNT, 16080 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 200 V, 2.7 uF, SURFACE MOUNT, 16080 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 4000 V, 0.1 uF, SURFACE MOUNT, 16080 CHIP
|
Agilent Technologies, Inc.
Yageo, Corp.
Ecliptek, Corp.
SEMIKRON
Alliance Semiconductor, Corp.
Coilcraft, Inc.
SCHURTER AG
|
| LDB211G9020C-001 LDB21906M20C-001 LDB21906M05C-001 |
Chip Multilayer Hybrid Baluns 1800 MHz - 2000 MHz RF TRANSFORMER
Chip Multilayer Hybrid Baluns 887 MHz - 925 MHz RF TRANSFORMER
Chip Multilayer Hybrid Baluns 800 MHz - 1000 MHz RF TRANSFORMER
Chip Multilayer Hybrid Baluns 1500 MHz - 1700 MHz RF TRANSFORMER
Chip Multilayer Hybrid Baluns 1600 MHz - 1800 MHz RF TRANSFORMER
|
Murata Manufacturing Co., Ltd.
|
| HKQ0603W1N4S-T-19 |
High-Q Multilayer Chip Inductors for High Frequency Applications (HK series Q type)[HKQ-W]
|
Taiyo Yuden (U.S.A.), I...
|
| HKQ0603S1N1S-T HKQ0603S1N1S-T-19 |
High-Q Multilayer Chip Inductors for High Frequency Applications (HK series Q type)[HKQ-S]
|
Taiyo Yuden (U.S.A.), I...
|
| HKQ04020N5C-T |
High-Q Multilayer Chip Inductors for High Frequency Applications
|
Taiyo Yuden (U.S.A.), I...
|
| HKQ0603W0N9B-T |
High-Q Multilayer Chip Inductors for High Frequency Applications
|
Taiyo Yuden (U.S.A.), I...
|
| HKQ0603W1N8C-T |
High-Q Multilayer Chip Inductors for High Frequency Applications
|
Taiyo Yuden (U.S.A.), I...
|
| HKQ0603W0N8S-T |
High-Q Multilayer Chip Inductors for High Frequency Applications
|
Taiyo Yuden (U.S.A.), I...
|
|
